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Japan advances in quantum race with world’s largest-class superconducting quantum computer

News RoomBy News RoomJune 20, 2025
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The development of a 256-qubit superconducting quantum computer by scientists at RIKEN and Fujitsu represents a significant achievement in the field of quantum computing, marking a milestone in advancing quantum hardware. This achievement demonstrates the potential of high-density qubit configurations and innovative cooling techniques to achieve scaling beyond current market standards. Here’s a detailed summary of the key points from the article:

1. Technical Innovation and Advancements

  • Superconducting Qubits and Density: RIKEN and Fujitsu developed a prototype quantum computer equipped with 256 qubits, exceeding the density of previous generations. This advancement involves integrating qubit units into a 3D structure, which not only enhances physical density but also simplifies scaling to accommodate arbitrary chip sizes without redesign concerns.

  • Free Design Features: The system’s qubit units are connected in a hierarchical, 3D cluster, ensuring efficient scalability. Each qubit is connected to others through complex packaging, requiring more cryogenic infrastructure to manage multi-core and multi-line connections.

2. Global Collaboration and Further Enhancements

  • Fujitsu’s(spaceship beyond Google): Fujitsu’s partnership with RIKEN has established they as global leaders in quantum hardware production, especially in 3D architecture. This partnership has opened doors for more advanced systems and collaborations with international partners.

  • Embrace of Scale and Problem Solving: Fujitsu emphasizes that achieving a 256-qubit system is about overcoming challenges like heat loss and decoherence. They highlight the barrier of one million qubits, a common threshold for fault-tolerant quantum computing, while progressing stepwise towards smaller systems.

3. Quantum Computer Components

  • Hybrid Platform: The researchers developed a hybrid quantum computer that includes both qubits and quantum simulators. This setup provides flexibility in addressing diverse problems, beyond mere computation.

  • Cloud Platform and Modifications: Fujitsu mandates access to external companies through a cloud platform and has initiatives in global collaboration, potentially drawing in major global discretion targets. This approach ensures that key researchers and institutions can access the advanced system.

4. Learning for the Future

  • Trait of 256-Qubit Design: The 256-qubit system represents the first "efficient step" in scaling quantum computers. Its modular architecture, leveraging a 3D grid, makes it easier to expand without redesigning systems, avoiding core redundancy issues.

  • Consideration of Data Protection: Enhancing correntropy is an ongoing challenge, with manufacturers striving to meet the 1 million-qubit threshold, a crucial step towards functional quantum computing.

5. Industry Aspects and Challenges

  • Industrial vs. Academic Standards: While both Google and IBM are striving towards the 1 million-qubit threshold, the latter has been widely adopted only to the point that exact scales aren’t always necessary. Fujitsu, due to their global reach, is making significant strides without risking premature adoption.

  • Risk of Component Overuse: Replacing superconducting qubits with hefty sg早些存储单元 (SRAM) is seen as risky, highlighting the need for precise design and manufacturing.

6. Conclusion: A Staring Stone for the Future

The 256-qubit system, symbolically representing a step toward practical quantum computing, is a testament to RIKEN and Fujitsu’s ingenuity. Their collaboration represents a unique trajectory, catering to heavy use in finance, chemistry, and drug research, while leaving room for the global industry to expand this vision. The authors conclude that this 3D architecture, combined with potential advancements, could be a game-changer, paving the way for real-world applications and driving the future of quantum computing. While overcoming the scale barrier remains paramount, the unique 3D design of this chip continues to set a precedent for future innovation.

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